ultrasonic soldering

Type: ultrasonic fluxless soldering Model: USE-60P / USE-60E / USE-40P / USE-40E / USE-28P / USE-28E Params: ultrasonic frequency: 20–60 kHz ultrasonic power: 28–100 W soldering temperature: 200–450°C heating method: resistive heating / integrated hot tip wetting capability: flux-free activation via ultrasonic cavitation solder alloy range: Sn-based / Zn-based / In-based alloys（如 Sn-Si / Sn-Zn / Zn-Al 系） bonding strength control: ultrasonic amplitude adjustable (micron-level vibration) process mode: manual / semi-automatic precision bonding Material: Stainless steel / titanium alloy Applicable Industry: semiconductor packaging & electronics manufacturing aerospace & aviation engineering medical device manufacturing solar / photovoltaic systems power electronics & advanced packaging glass-to-metal sealing industry R&D laboratories & materials science research sensor & MEMS device manufacturing advanced joining of dissimilar materials industry