Using active solder to complete heterogeneous material welding for semiconductor sputtering equipment, MEMS sensors, and thermal management components; Realize direct bonding of different materials such as aluminum, copper, silicon, ceramics, and hard alloys without the use of solder flux; Used for sputtering target backplate bonding, optical mirror encapsulation, and gas flow controller sealing processes.Product
semiconductor equipment manufacturer
The porosity of the welding interface is extremely low, the thermal conductivity is excellent, and the equipment runs continuously for a long time without delamination; No residual flux pollution, avoiding the risk of impurity interference in semiconductor plasma chambers; The shear strength of the weld exceeds 5000psi, it is resistant to high and low temperature cyclic impact, and the cracking rate of the target material is significantly reduced; Simplify the pre-processing process, significantly improve product yield, and reduce the frequency of later repairs.
2 setsQuantity
4 yearsDuration