Ultrasonic Atomizer UAM6000 For PCB Flux Coating

The UAM6000 ultrasonic atomizer is optimized for high-volume PCB flux coating. It generates uniform microscale droplets (5-30 μm) to achieve a consistent solder film thickness of 1-8 μm, improving soldering quality and reducing defects. Its non-clogging, anti-blockage design ensures continuous production, while the closed atomization chamber minimizes overspray, increasing flux utilization to over 90%.

Key Selling Points

• Uniform micro-atomization: Droplet sizes of 5-30 μm ensure even coating without pinholes or agglomerates, enhancing solder joint reliability.
• High material utilization: Closed directional atomization reduces splashing, achieving over 90% flux utilization, cutting consumable costs by up to 55%.
• Non-blocking nozzle: Open ultrasonic nozzle with automatic cleaning reduces maintenance downtime by 90%, increasing production line efficiency by 22%.
• Low-pressure non-contact spraying: Avoids damage to thin PCBs and mini components, preventing deformation and displacement.
• PLC integration: Fully automatic control with one-click parameter storage ensures consistent mass production quality.

Technical Specifications

Models and Options

The UAM6000 is part of the UAM series, including UAM1000, UAM2000, UAM4000, UAM6000, UAM8000, UAM9000, each suitable for different production speeds and coating areas.

Materials and Structure

Made of stainless steel and titanium alloy, the atomizer features a non-clogging ultrasonic vibration structure with automatic cleaning function. The closed spray chamber prevents overspray and contains emissions.

Applications

Specifically designed for PCB pre-soldering flux coating, including civil communication, industrial control, vehicle electronics, and sensor precision circuits. It supports spray fluxing for various board types including hard boards and flexible circuits.

Customization

Customizable spray patterns (full-board or selective) and integration with existing production lines. Parameters are adjustable via PLC, supporting multiple flux types including no-clean and water-soluble.

Case Study

A leading microelectronics R&D institution in the US used 20 units for high-end PCB flux coating. Over 10 years, the soldering defect rate decreased by 68%, flux consumption reduced by 55%, and the board scrap rate dropped from 19% to below 2.5%. Nozzle blockage frequency decreased by 90%, increasing production uptime by 22%.

FAQ