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cheersonic

China

+8615869049660

📧 market2@cheersonic.com

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www.cheersonic.com

Annual Output

1,200 units

Total Employees

100

Business Type

Smart Manufacturing

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UAM6000 Ultrasonic Photoresist Coating System for MEMS and Advanced Packaging

Name: "UAM6000 Ultrasonic Photoresist Coating System for MEMS and Advanced Packaging"
Rating: 5 (561 reviews)

Quantity:

SKU: 1715624041

Model: UAM6000 / UAM4000

Product Details

UAM6000 Ultrasonic Photoresist Coating System

Conformal photoresist coating for MEMS and advanced packaging

Product Overview

The UAM6000 ultrasonic coating system is optimized for photoresist application in semiconductor manufacturing. It provides conformal coverage on 3D topographies including deep grooves and steps, essential for MEMS and advanced packaging. It supports both positive and negative photoresist, including SU-8 thick resists, with thickness control from 20 nm to 100 μm.

Key Selling Points

Conformal Coverage
Uniform coating on 3D microstructures with low kinetic energy, no pinholes.

SU-8 Compatibility
Handles high-viscosity SU-8 and standard photoresists.

High Uniformity
Film thickness error ±2%, ideal for lithography processes.

Material Savings
Photoresist utilization over 90%, reduces chemical costs.

Cleanroom Ready
Class 1000 compatible, low static generation.

Technical Specifications

Parameter	Value
Model	UAM6000
Operating Frequency	25–180 kHz
Flow Rate	0.001–50 mL/min
Droplet Size	18–200 μm
Film Thickness	20 nm–100 μm
Material	Stainless steel / titanium alloy

Models and Options

UAM6000 and UAM4000 with various nozzle configurations for different wafer sizes and coating requirements.

Materials and Structure

Chemical-resistant stainless steel and titanium alloy construction. Sealed spray chamber with anti-corrosion coating and dust-free design.

Applications

MEMS sensor production, wafer-level packaging, microfluidic device fabrication, and other semiconductor processes requiring conformal photoresist coating.

Customization

Custom XYZ motion systems, vacuum chucks, and process recipes can be provided.

Case Study

A MEMS acoustic sensor chip manufacturer used the UAM6000 for deep trench photoresist coating. Defect rate reduced by 70%, chip yield improved by 12%, and photoresist consumption cut by 55%.

FAQ

What is the MOQ?

1 unit.

Can it handle SU-8 thick photoresist?

Yes, the anti-clogging nozzle is compatible with high-viscosity SU-8.

What cleanroom class is it suitable for?

Class 1000 and above.

What payment terms are available?

30% T/T deposit, 70% before shipment.

Does it support double-sided coating?

Optional dual-nozzle configuration available.

Inquiry Information

Contact: Beaty Mao
Email: market2@cheersonic.com
Tel/WhatsApp: +86 133-7254-0303 / +86 158-6904-9660

Image and Alt Suggestions

Main image: UAM6000 photoresist coating system spraying wafer. Alt: UAM6000 ultrasonic photoresist coating system for MEMS wafers.