{{ variable.name }}
The UAM6000 ultrasonic spray coating system is designed for high-precision coating in the electronics industry, including photoresist deposition for MEMS wafers, polyimide dielectric layers, and flux spraying for PCB assembly. It delivers uniform thin films from 50 nm to 30 μm with thickness tolerance ±2%. The non-contact, low-pressure atomization prevents damage to fragile substrates and microstructures. The system is designed for Class 100/1000 cleanroom compatibility, with self-cleaning nozzles to ensure reliable operation with high-purity chemicals.
Deep trench lithography defect rate reduced by 70% in MEMS applications, with chip yield increased by over 12%.
Photoresist consumption cut by 55%, significantly lowering high-value SU-8 chemical costs.
Designed for Class 100/1000 environments with low static and particle generation.
Support ultra-thin 50nm to thick 30μm coatings, with film thickness error controlled within ±2%.
Material utilization rate over 70%, reducing waste and cost.
| Model | UAM6000 |
|---|---|
| Operating Frequency | 25–180 kHz |
| Flow Rate | 0.001–50 mL/min (application dependent) |
| Droplet Size | 18–200 μm (frequency dependent) |
| Film Thickness | 20 nm–100 μm |
| Coating Uniformity | High precision, non-clogging atomization |
| Material | Stainless steel / titanium alloy |
The UAM6000 is part of the UAM series. It can be equipped with XYZ three-axis programmable motion, vacuum adsorption fixtures, and various ultrasonic nozzles suitable for low-viscosity photoresists and high-viscosity thick-film materials. Options include automatic loading/unloading and online thickness measurement.
The equipment is constructed from stainless steel and titanium alloy and features a sealed clean chamber, self-cleaning anti-clogging nozzle, and a PLC-based control system. The compact design minimizes footprint in cleanrooms.
Customizable options include specialized substrate fixtures, high-precision motion systems, integration with production lines, and compatibility with specific photoresist or flux chemistries. Our engineers provide process development support.
MEMS Acoustic Sensor Chip Manufacturer (South Korea)
Application: Conformal photoresist spraying on MEMS wafers with deep grooves.
Result: Deep trench lithography defect rate reduced by 70%, photoresist consumption reduced by 55%, chip yield increased over 12%.
MOQ is 1 unit.
We support FOB, CIF, and DDP terms.
We conduct a full performance test at our factory and provide video and test reports for your confirmation before shipment.
We accept 30% T/T deposit upon order confirmation and 70% balance T/T against the copy of Bill of Lading.
Yes, the anti-clogging nozzle is compatible with SU-8 thick photoresist and low-viscosity photoresists, with adjustable coating thickness from 10nm to 100μm.
Yes, it is designed with a sealed clean chamber and low particle generation.
Yes, the UAM6000 can be fully automated and integrated into production lines.
For more information or to request a quote, please contact:
Email: market2@cheersonic.com | Phone: +86 133-7254-0303 | WhatsApp: +86 158-6904-9660
Hangzhou Cheersonic Ultrasonics Equipments Co., Limited, No. 11-13, Chuangye Road, Changkou Town, Fuyang District, Hangzhou City, Zhejiang Province, China