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Precision Ultrasonic Soldering System USE-40E for R&D and Sensor Manufacturing

Quantity:
SKU: 8421374621
Model: USE-60P / USE-60E / USE-40P / USE-40E / USE-28P / USE-28E

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Product Details

Precision Ultrasonic Soldering System USE-40E for R&D and Sensor Manufacturing

url-slug: precision-ultrasonic-soldering-system-use-40e-rd-sensor-manufacturing

Product Summary

The USE-40E is a precision ultrasonic soldering system designed for R&D laboratories and sensor manufacturing. With a frequency range of 28-40 kHz and 40W power, it delivers controlled, flux-free bonding for sensitive components. Its temperature range of 200-450°C allows for low-stress joining of dissimilar materials, making it an essential tool for developing advanced sensors and MEMS devices.

Key Selling Points

  • Precise control over ultrasonic amplitude enables delicate bonding for small parts.
  • Flux-free operation is ideal for R&D applications where contamination is critical.
  • Wide temperature range accommodates a variety of solder alloys and substrates.
  • Compact and user-friendly design fits easily into lab environments.
  • Reliable performance backed by ISO9001 certified production.

Technical Specifications

ParameterValue
Ultrasonic Frequency28-40 kHz
Ultrasonic Power40W
Soldering Temperature200-450°C
Heating MethodResistive heating / integrated hot tip
Wetting CapabilityFlux-free activation via ultrasonic cavitation
Solder Alloy RangeSn-based, Zn-based, In-based alloys
Bonding Strength ControlUltrasonic amplitude adjustable (micron-level)
Process ModeManual / semi-automatic precision bonding

Models and Options

This model is part of the USE series with various power and frequency options to meet different needs.

Materials and Structure

Constructed with stainless steel and titanium alloy, ensuring durability and resistance to harsh chemicals. The system features a stable piezoelectric generator and an easy-to-clean heating tip.

Applications

  • R&D laboratories & materials science research
  • Sensor & MEMS device manufacturing
  • Advanced joining of dissimilar materials
  • Medical device prototypes
  • Aerospace component repair

FAQ

Q: What makes this system suitable for R&D?

Its precise control and ability to bond dissimilar materials without flux are critical for R&D experiments.

Q: Can it handle small and delicate components?

Yes, the low power and adjustable amplitude allow for gentle bonding on micro-sized parts.

Q: Is training required to operate?

Minimal training is needed; we provide English manuals and remote support.

Q: Can it be used with lead-free solders?

Absolutely, it supports Sn-based, Zn-based, and In-based alloys, which are commonly lead-free.

Q: What is the warranty period?

We offer a standard warranty; please contact us for details.

Q: Are spare parts easily available?

Yes, we maintain an inventory of commonly used spare parts.

Q: Does it comply with international standards?

Our company is ISO9001 certified, and the equipment is designed to meet CE requirements.

Inquiry Information

For requests or further details, contact:

Beaty Mao
Email: market2@cheersonic.com
Tel: +86 133-7254-0303

Images

Image: USE-40E ultrasonic soldering system - front angle
Alt: Precision ultrasonic soldering system USE-40E for R&D and sensors