Fluxless Ultrasonic Soldering System USE-60P for Semiconductor Packaging
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Product Summary
The USE-60P is a precision ultrasonic soldering system designed for fluxless soldering of dissimilar materials in semiconductor packaging and electronics manufacturing. With a frequency range of 40-60 kHz and power up to 60W, it enables reliable bonding without chemical flux. Suitable for materials like stainless steel and titanium alloy, it operates at temperatures from 200-450°C, ensuring minimal thermal stress on sensitive components. This system is ideal for applications requiring high cleanliness and low defect rates, such as sputtering target backplate bonding and sensor packaging.
Key Selling Points
- Flux-free operation eliminates cleaning steps and contamination risks, improving process efficiency.
- Precise temperature control with 200-450°C range protects heat-sensitive components.
- Broad material compatibility including stainless steel, titanium alloy, ceramics, and glass.
- Adjustable ultrasonic amplitude ensures optimal bonding strength for various joint designs.
- Designed for cleanroom environments, meeting stringent semiconductor manufacturing requirements.
Technical Specifications
| Parameter | Value |
|---|
| Ultrasonic Frequency | 40-60 kHz |
| Ultrasonic Power | 60W |
| Soldering Temperature | 200-450°C |
| Heating Method | Resistive heating / integrated hot tip |
| Wetting Capability | Flux-free activation via ultrasonic cavitation |
| Solder Alloy Range | Sn-based, Zn-based, In-based alloys |
| Bonding Strength Control | Ultrasonic amplitude adjustable (micron-level) |
| Process Mode | Manual / semi-automatic precision bonding |
Models and Options
This system is part of the USE series, which includes USE-60P, USE-60E, USE-40P, USE-40E, USE-28P, and USE-28E, offering different power and frequency configurations to suit various applications.
Materials and Structure
The system is constructed with stainless steel and titanium alloy components, ensuring durability and resistance to harsh operating environments. The design integrates a piezoelectric ultrasonic generator and a heating cartridge for compact and efficient operation.
Applications
- Semiconductor packaging & electronics manufacturing
- Aerospace & aviation engineering
- Medical device manufacturing
- Solar / photovoltaic systems
- Power electronics & advanced packaging
- R&D laboratories & materials science research
FAQ
Q: Can the USE-60P solder without flux?
Yes, the USE-60P utilizes ultrasonic cavitation to remove oxide layers, enabling flux-free soldering.
Q: What materials can be soldered with this system?
It can bond stainless steel, titanium alloy, ceramics, glass, and various dissimilar metal combinations.
Q: Is the temperature control precise?
Yes, the system provides temperature control within 200-450°C, ensuring stable and repeatable soldering results.
Q: What certifications does the system have?
The manufacturing facility is ISO9001 certified, and the system is designed to comply with CE and other relevant standards.
Q: Can the system be used for automated production?
Yes, the USE-60P supports semi-automatic operation and can be integrated into automated production lines.
Q: What is the minimum order quantity?
MOQ is 1 unit, and we offer various delivery methods including FOB, CIF, and DDP.
Q: How is the equipment tested before shipment?
Each unit undergoes a full performance test, and video and test reports are provided for customer confirmation.
Q: Is training provided?
Yes, we offer remote online debugging and English manuals to ensure smooth operation.
Inquiry Information
For more details or to place an order, please contact us:
Beaty Mao
Email: market2@cheersonic.com
Tel/WhatsApp: +86 133-7254-0303
Images
Image: USE-60P ultrasonic soldering - front view
Alt: USE-60P ultrasonic soldering system for semiconductor packaging
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