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Compact Ultrasonic Soldering System USE-40P for Medical Device Manufacturing

Quantity:
SKU: 1405418664
Model: USE-60P / USE-60E / USE-40P / USE-40E / USE-28P / USE-28E

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Product Details

Compact Ultrasonic Soldering System USE-40P for Medical Device Manufacturing

url-slug: compact-ultrasonic-soldering-system-use-40p-medical-device-manufacturing

Product Summary

The USE-40P is a compact ultrasonic soldering system optimized for medical device manufacturing, where precision and cleanliness are paramount. Operating at 28-40 kHz with 40W power and a temperature range of 200-450°C, it provides flux-free soldering capabilities for a variety of materials, including stainless steel, titanium, and ceramics. Its small footprint makes it ideal for bench-top use in R&D and small-batch production of medical components.

Key Selling Points

  • Compact design saves space and is easy to integrate into existing workstations.
  • Flux-free processing eliminates contaminants, meeting medical quality standards.
  • Low temperature operation protects heat-sensitive materials and components.
  • Precise bonding control via adjustable ultrasonic amplitude for fine joints.
  • Compatible with multiple alloys including zinc-based, suitable for medical applications.

Technical Specifications

ParameterValue
Ultrasonic Frequency28-40 kHz
Ultrasonic Power40W
Soldering Temperature200-450°C
Heating MethodResistive heating / integrated hot tip
Wetting CapabilityFlux-free activation via ultrasonic cavitation
Solder Alloy RangeSn-based, Zn-based, In-based alloys
Bonding Strength ControlUltrasonic amplitude adjustable (micron-level)
Process ModeManual / semi-automatic precision bonding

Models and Options

This model is part of the USE series with options USE-60P, USE-60E, USE-40P, USE-40E, USE-28P, and USE-28E.

Materials and Structure

The system uses stainless steel and titanium alloy construction, providing durability and resistance to corrosion. Its compact structure integrates a piezoelectric transducer and a precise heating control unit.

Applications

  • Medical device manufacturing
  • Sensor & MEMS device manufacturing
  • Power electronics & advanced packaging
  • Solar / photovoltaic systems
  • R&D laboratories

FAQ

Q: Is the USE-40P suitable for cleanroom use?

Yes, its flux-free operation minimizes contaminants, suitable for medical and semiconductor cleanrooms.

Q: Can it solder titanium and stainless steel?

Yes, it can bond these metals without flux, ensuring strong joints.

Q: What is the temperature control accuracy?

The temperature is precisely controlled within 200-450°C, ensuring repeatable results.

Q: Does it support automated processes?

It supports semi-automatic operation and can be integrated with external automation systems.

Q: What are the main advantages over traditional soldering?

It eliminates flux residue, reduces cleaning, and enables bonding of difficult materials like ceramics.

Q: How is the product packaged for shipping?

We ensure secure packaging to prevent damage during transit.

Q: Can we get a sample for testing?

Samples are available upon request; please contact us for details.

Inquiry Information

For purchasing or technical inquiries, reach out to:

Beaty Mao
Email: market2@cheersonic.com
WhatsApp: +86 158-6904-9660

Images

Image: USE-40P ultrasonic soldering system - front view
Alt: Compact ultrasonic soldering system USE-40P for medical devices